Part Number Hot Search : 
100V1 MC409 00206 DM74L 2SC23 LE105M P60N55 IR2C23
Product Description
Full Text Search
 

To Download S4DNFS30 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 STS4DNFS30
N-channel - 30V - 0.044 - 4.5A SO-8 STripFETTM Power MOSFET plus schottky rectifier
General features
Type STS4DNFS30 Schottky VDSS 30V IF(AV) 4.5A RDS(on) <0.055 VRRM 30V ID 4.5A VF(MAX) 0.53V SO-8
Description
This product associates the latest low voltage STripFETTM in n-channel version to a low drop Schottky diode. Such configuration is extremely versatile in implementing a large variety of DC-DC converters for printers, portable equipment.
Internal schematic diagram Applications
Switching application
Order codes
Part number STS4DNFS30 Marking S4DNFS30 Package SO-8 Packaging Tape & reel
July 2006
Rev 1
1/12
www.st.com 12
Contents
STS4DNFS30
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5
Test circuits
.............................................. 8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
STS4DNFS30
Electrical ratings
1
Electrical ratings
Table 1.
Symbol VDS VGS ID ID IDM
(1)
Mosfet absolute maximum ratings
Parameter Drain-source voltage (VGS = 0) Gate- source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC = 100C Drain current (pulsed) Total dissipation at TC = 25C Value 30 20 4.5 3.2 13 2 Unit V V A A A W
PTOT
1. Pulse width limited by safe operating area
Table 2.
Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM dv/dt
Schottky absolute maximum ratings
Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Critical rate of rise of reverse voltage TL=125C =0.5 tp=10ms Sinusoidal tp=2s F=1kHz tp=100s Value 30 10 4 75 1 1 10000 Unit V A A A A A v/s
Table 3.
Symbol
Thermal data
Parameter
(1)
Value 62.5 -55 to 150 -55 to 150
Unit C/W C C
Rthj-amb Thermal resistance junction-amb Mosfet Tstg Tj Storage temperature range Max Junction temperature
1. Mounted on FR-4 board (steady state)
3/12
Electrical characteristics
STS4DNFS30
2
Electrical characteristics
(Tcase =25C unless otherwise specified) Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on)
On /off states
Parameter Drain-source breakdown voltage Test conditions ID = 250A, VGS = 0 Min. 30 1 10 100 1 0.044 0.055 0.085 Typ. Max. Unit V A A nA V
VDS = Max rating Zero gate voltage drain current (VGS = 0) VDS = Max rating, TC=125C Gate-body leakage current (VDS = 0) VGS = 20V
Gate threshold voltage VDS = VGS, ID = 250A Static drain-source on resistance VGS = 10V, ID = 2A VGS = 5V, ID = 2A
Table 5.
Symbol IR (1)
Static
Parameter Reverse leakage current Test conditions Tj = 25C Tj = 100C Tj = 25C Tj = 125C VR = VRRM IF = 2A IF = 4A Min. Typ. Max. 200 15 0.45 0.375 0.53 0.51 Unit A mA V V V V
6 0.325 0.43
VF (1)
Zero gate voltage drain current (VGS = 0) Tj = 25C Tj = 125C
1. Pulse test: tp=380s, < 2%. To evaluate the conduction losses use the following equation:
P = 0.24 x I F ( AV ) + 0.068I 2 ( RMS )
F
Table 6.
Symbol gfs Ciss Coss Crss Qg Qgs Qgd
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS =10V, ID =2A Min. Typ. 5 330 115 28 4.7 1.2 2.1 Max. Unit S pF pF pF nC nC nC
VDS = 25 V, f = 1 MHz, VGS = 0
VDD = 15V, ID = 4.5A, VGS = 5V (see Figure 13)
4/12
STS4DNFS30
Electrical characteristics
Table 7.
Symbol td(on) tr td(off) tf
Switching times
Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test Conditions VDD = 15V, ID = 2A, RG = 4.7, VGS = 5V (see Figure 12) VDD = 15V, ID = 2A, RG = 4.7, VGS = 5V (see Figure 12) Min. Typ. 9 17 15 6 Max Unit ns ns ns ns
Table 8.
Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 4.5A, VGS = 0 ISD = 4.5A, di/dt = 100A/s VDD = 15V, Tj = 150C (see Figure 17) 22 14.3 1.3 Test Conditions Min. Typ. Max. Unit 4.5 13 1.2 A A V ns nC A
1. Pulse width limited by safe operating area 2. Pulsed: Pulse duration = 300 s, duty cycle 1.5 %
5/12
Electrical characteristics
STS4DNFS30
2.1
Figure 1.
Electrical characteristics (curves)
Safe operating area Figure 2. Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
Figure 5.
Source-drain diode forward characteristics
Figure 6.
Static drain-source on resistance
6/12
STS4DNFS30 Figure 7. Gate charge vs gate-source voltage Figure 8.
Electrical characteristics Capacitance variations
Figure 9.
Normalized gate threshold voltage vs temperature
Figure 10. Normalized on resistance vs temperature
Figure 11. Normalized BVDSS voltage vs temperature
7/12
Test circuits
STS4DNFS30
3
Test circuits
Figure 13. Gate charge test circuit
Figure 12. Switching times test circuit for resistive load
Figure 14. Test circuit for inductive load Figure 15. Unclamped inductive load test switching and diode recovery times circuit
Figure 16. Unclamped inductive waveform
Figure 17. Switching time waveform
8/12
STS4DNFS30
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
9/12
Package mechanical data
STS4DNFS30
SO-8 MECHANICAL DATA
DIM. A a1 a2 a3 b b1 C c1 D E e e3 F L M S 3.8 0.4 4.8 5.8 1.27 3.81 4.0 1.27 0.6 8 (max.) 0.14 0.015 5.0 6.2 0.65 0.35 0.19 0.25 0.1 mm. MIN. TYP MAX. 1.75 0.25 1.65 0.85 0.48 0.25 0.5 45 (typ.) 0.188 0.228 0.050 0.150 0.157 0.050 0.023 0.196 0.244 0.025 0.013 0.007 0.010 0.003 MIN. inch TYP. MAX. 0.068 0.009 0.064 0.033 0.018 0.010 0.019
10/12
STS4DNFS30
Revision history
5
Revision history
Table 9.
Date 19-Jul-2005
Revision history
Revision 1 First release Changes
11/12
STS4DNFS30
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
12/12


▲Up To Search▲   

 
Price & Availability of S4DNFS30

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X